With all of these developments and continuing research going into finding better ways and better precursors to make better thin films there are definitely going to be problems that are going to arise. For this post we are going to focus on thin films made from the group IV and V transition metals with nitrogen to made nitride thin films. There is a demand in industry for nitride thin films due the desirable qualities they possess, including how hard they are, long wear residence, high melting point and good chemical resistance. These qualities of nitride thin films makes them the major component in many applications, including coatings for cutting and grinding tools, wear surfaces and semiconductors.
TDEAT, an example of a single source precursor used to deposit TiN thin films. Another focus for future precursors is to be able to synthesis complexes in lower oxidation states (as discussed in Where did that plane get its nice coat?). A key example of this is TaN which was mentioned above. When in the 3+ state it forms the stoichiometric form which is conductive whereas if the +5 state is formed it dimerizes and forms the Ta3N5 which is insulating. It’s clear what issues can arise if the wrong oxidation state is formed. The same issue arises for other group IV and V transition metals when using lower oxidation state complexes. When in a lower oxidation state, the complexes have a tendency to dimerize like in the case of zirconium coordination complexes in a 3+ state. An idea to overcome this is to use bulky ligands. The bulkiness of the ligands will cause strict steric conditions which will prevent the complexes from dimerises and keeping the final thin film in the desired low oxidation state. |
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